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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
Automatische name übersetzung:
Standard-Prüfverfahren für Mess Zugfestigkeit von Mikrodrahtverbindungen
NORM herausgegeben am 1.1.2006
Bezeichnung normen: ASTM F459-06
Anmerkung: UNGÜLTIG
Ausgabedatum normen: 1.1.2006
SKU: NS-55377
Zahl der Seiten: 4
Gewicht ca.: 12 g (0.03 Pfund)
Land: Amerikanische technische Norm
Kategorie: Technische Normen ASTM
Keywords:
pull strength of microelectronic wire bonds, aluminum ultra-sonic wedge bonds, aluminum ball bonds, gold wedge bonds, ball bonds, wire bonds, ICS Number Code 29.120.20 (Connecting devices)
Significance and Use | ||
Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire bond. These methods can assist in maintaining control of the process of making wire bonds. They can be used to distinguish between weak, nonadherent wire bonds and acceptably strong wire bonds. The methods are destructive. These test methods are appropriate for on-line use for process control, for purchase specifications, and for research in support of improved yield or reliability. The referee method should be used for quantitative comparison of pull strengths of wire bonds. |
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1. Scope | ||
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 m). Note 1Common usage at the present time considers the term "wire bond" to include the entire interconnection: both welds and the intervening wire span. 1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see ) to be placed under the wire. 1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for aluminum ball bonds and gold wedge or ball bonds, as aluminum wedge bonds are the most sensitive to manufacturing variations (such as bond deformation) of any wire-bond type. 1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance. 1.5 A nondestructive procedure is described in Practice F 458. 1.6 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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2. Referenced Documents | ||
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