DIN EN 60191-6-21:2011-03

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).

NORM herausgegeben am 1.3.2011

The information about the standard:

Designation standards: DIN EN 60191-6-21:2011-03
Publication date standards: 1.3.2011
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: German technical standard
Kategorie: Technische Normen DIN