Format for LSI-Package-Board Interoperable design
NORM herausgegeben am 11.10.2023
Designation standards: IEC 63055-ed.2.0
Publication date standards: 11.10.2023
The number of pages: 292
Approximate weight : 907 g (2.00 lbs)
Country: International technical standard
Kategorie: Technische Normen IEC
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.